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FIB Engineer I-IV

(HTA) NCP (Hillsboro, OR)💼 Full-time💰 $66,756–$66,756🗓 2026-07-20 → 2026-07-30

Core

Operate dual beam FIB-SEM and S/TEM equipment to prepare samples and perform imaging analysis for semiconductor device evaluation.

Role type

FIB Engineer (IC)

Builds

Sample preparation and analytical data for semiconductor process development and failure analysis

Domain

Semiconductor manufacturing / Materials Science

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Dual beam FIB operation, S/TEM imaging, sample preparation, EDX analysis, EELS analysis, lab equipment maintenance, technical reporting

Preferred skills

Semiconductor device analysis experience, process development collaboration

Technologies

FIB-SEM, S/TEM, EDX, EELS, lab management software

Responsibilities

Prepare routine and novel samples for S/TEM analysis, obtain high-resolution images and diffraction patterns, develop faster sample preparation methods, compile data and prepare technical reports, interface with internal customers and management

Seniority

Entry to Senior (0-3 years for I, 15+ years for I-IV)

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