Materials Analyst, Microscopy (Dual Beam FIB)
Core
Preparing high-quality, site-specific TEM lamella using Dual Beam FIB-SEM systems for advanced materials and semiconductor failure analysis.
Role type
Materials Analyst (TEM lamella preparation)
Builds
TEM samples for client failure analysis and materials characterization
Domain
Materials Science / Semiconductor Failure Analysis
Deliverable
physical/clinical work
Required skills
TEM lamella preparation, Dual Beam FIB-SEM operation, SEM imaging, electron microscopy principles, semiconductor device physics, failure analysis concepts
Preferred skills
TEM lift-out techniques, high-throughput lab environment experience
Technologies
Dual Beam FIB-SEM systems, SEM, TEM
Responsibilities
Prepare TEM lamella using Dual Beam FIB-SEM systems, perform SEM imaging for sample navigation and verification, manage multiple client samples, optimize workflows, collaborate with internal teams and clients
Seniority
Mid-level, hands-on IC