Thermal Mechanical Engineer
Core
Design and validate thermal management solutions for high-density computing hardware, including AI servers and HPC platforms.
Role type
Senior IC thermal mechanical engineer (data center cooling)
Builds
Direct-to-chip cooling systems, cold plates, rack-level cooling, CDU integration, and immersion cooling architectures for AI servers and HPC platforms.
Domain
Data center infrastructure / High-performance computing / Thermal engineering
Required skills
Direct-to-chip cooling design, cold plate design, rack-level cooling, CDU integration, immersion cooling, chip-to-chiller architecture, thermal cycling analysis, vibration and shock analysis, pressure cycling analysis, HALT/HASS test planning, environmental stress testing, coolant compatibility assessment, corrosion mitigation, filtration design, contamination control, leak detection, sealing strategy, long-term reliability risk assessment, supplier design review, tooling qualification, process qualification, cost reduction, production ramp management.
Preferred skills
Experience with AI servers, HPC platforms, GPU/accelerator systems, power electronics, high-density data center infrastructure, manufacturing technologies, supplier-facing experience.
Technologies
AI servers, HPC platforms, GPU/accelerator systems, power electronics, high-density data center infrastructure, direct-to-chip cooling, cold plates, rack-level cooling, CDU, immersion cooling, chip-to-chiller architectures.