Research Fellow (Flexible Electronics)
Core
Design, fabricate, and characterize stretchable and flexible interconnects and bonded joints on soft, deformable substrates using printable conductive materials and low-temperature/photonic bonding methods.
Role type
Research Fellow (Flexible Electronics)
Builds
Soft/flexible electronic devices, sensors, and system-level platforms
Domain
Materials Science / Flexible Electronics / Nanomaterials
Deliverable
production ML models | product features | research
Required skills
Design and fabrication of stretchable interconnects, printable conductive materials, low-temperature and photonic sintering/bonding, interfacial reaction and diffusion mechanisms, electromechanical reliability under deformation, conductive ink formulation, nanoparticle and composite material systems, microstructural and chemical characterization, mechanical and electrical/electromechanical testing
Preferred skills
Flexible/stretchable device fabrication, electronic/advanced packaging, interfacial reaction and diffusion, microstructure-property-reliability relationships
Technologies
Printable conductive materials, photonic sintering, low-temperature bonding, conductive inks, nanoparticle composites
Responsibilities
Design, fabricate, and characterize stretchable interconnects; Develop conductive inks and interface designs; Conduct microstructural, chemical, mechanical, and electromechanical characterization; Collaborate on integrating soft-interconnect solutions into devices; Assist in manuscript preparation and grant development; Mentor junior researchers
Seniority
Mid-Senior, hands-on IC researcher