Package Material R&D Engineer (New Grad)
Core
Drive innovation and performance improvement in key packaging materials (epoxy, molding compounds, underfill) for advanced semiconductor packages.
Role type
New Grad R&D Materials Engineer (Semiconductor Packaging)
Builds
Next-generation packaging materials for fan-out, SiP, and other advanced packages
Domain
Semiconductor industry / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Chemistry, formulation, processing, failure mode analysis, material characterization (TGA, DMA, rheology), reliability testing (MSL, TCT, HAST)
Preferred skills
null
Technologies
TGA, DMA, rheology, MSL, TCT, HAST
Responsibilities
Lead R&D of next-generation packaging materials; Develop and qualify 2nd source suppliers domestically; Define material specifications and qualification plans; Conduct technical analysis on material properties and failure mechanisms
Seniority
New Grad
