Early Supplier Involvement (ESI) Engineer - Multiple Openings
Core
Drive hardware co-design, manufacturability, and supply chain readiness for next-generation Data Center AI Infrastructure platforms.
Role type
Senior IC Early Supplier Involvement (ESI) Engineer
Builds
High-density AI computing systems, liquid cooling architectures, and high-speed interconnects
Domain
Data Center Hardware / AI Infrastructure / Thermal Management
Deliverable
production ML models | product features
Required skills
Liquid cooling technologies, High-speed PCBA design, Power delivery systems, GD&T & tolerance stack-up, CAD software (Creo/SolidWorks/NX), DFM reviews with Tier-1 suppliers, NPI prototyping, Single-source de-risking, Should-cost modeling
Preferred skills
High-frequency materials (Megtron), HDI manufacturing, Telcordia/OCP/NEBS standards, Automated should-cost tools (aPriori), PLM systems (Agile/Windchill)
Technologies
PCIe Gen 6/7, Optical interconnects, VRMs, PDUs, CDUs, Cold plates, QDCs, Manifolds, HDI PCBs
Responsibilities
Partner with liquid cooling suppliers on fluid dynamics and leak-mitigation designs, Conduct DFM/DFT reviews for complex AI accelerator boards and optical interconnects, Collaborate on ultra-high-density power distribution units and voltage regulator modules, Ensure structural integrity and alignment for rack-level mechanical integration, Oversee prototype builds to accelerate EVT/DVT cycles, Analyze component geometry and process flows to build accurate cost models
Seniority
Mid-Senior, hands-on IC