Sr. Staff/Principal Advanced Packaging Architect
Core
Lead research and development of package architecture for AI accelerators and data center products, defining reference packaging architecture and methodology for high-power, high-bandwidth multi-chiplet systems.
Role type
Sr. Staff/Principal Advanced Packaging Architect
Builds
High-performance, efficient, and reliable solutions for data center applications
Domain
Semiconductor packaging and data center infrastructure
Deliverable
production ML models
Required skills
Semiconductor packaging, metrology, characterization, STCO modeling, technology selection, 2.5D/3D architecture, CPO, IVR, HSIO
Preferred skills
Strategic partnerships, industry trend analysis, cross-functional collaboration
Technologies
2.5D/3D, CPO, IVR, HSIO
Responsibilities
Lead R&D of package architecture for AI accelerators; Define reference packaging architecture and methodology for multi-chiplet systems; Develop strategic partnerships with internal and external engineering teams; Provide technical leadership on industry trends; Lead architecture definition of advanced packaging solutions.
Seniority
Sr. Staff/Principal, strategic technology development and leadership
