Staff Engineer, Adv DRAM PI
Core
Lead technology development for the first vertically stacked memory device, bridging device physics, materials science, and process integration to enable future memory scaling.
Role type
Staff Engineer, Advanced DRAM Process Integration
Builds
Advanced memory devices (DRAM/NAND) for AI and high-performance computing
Domain
Semiconductor manufacturing / Memory technology / Materials science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, Materials science, Process integration, Experiment design, Data analysis, Statistical applications
Preferred skills
DRAM and NAND technology knowledge, Cross-functional team leadership, Project management, Alternative memory technology expertise
Technologies
300mm R&D fab equipment, Thin-film transistors, Charge storage devices
Responsibilities
Lead technology development for vertically stacked memory devices, Optimize process flows for quality and manufacturability, Collaborate with design and yield teams to resolve performance issues, Design and execute experiments in the R&D fab, Analyze parametric and probe data to evaluate failure mechanisms, Communicate technical findings and drive implementation of solutions
Seniority
Staff, hands-on IC with strategic scope