Metallization engineering lead
Core
Lead semiconductor process and equipment engineering teams to drive manufacturing excellence, yield improvement, and operational stability in wafer fab environments.
Role type
Senior Process/Equipment Engineering Lead (Semiconductor)
Builds
High-volume memory and storage manufacturing lines (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Wafer Fab / OSAT
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process engineering, Equipment engineering, Team leadership, Yield management, Statistical process control (SPC), Process control, Equipment reliability, Cross-functional collaboration, Data-driven decision making
Preferred skills
Advanced node experience, High-volume manufacturing (HVM), Ramp-up and new site expansion, Automation and smart manufacturing
Technologies
Wafer fab equipment, OSAT tools, SPC software, Manufacturing execution systems
Responsibilities
Lead and develop a team of process/equipment engineers, Drive process stability and yield improvement, Execute continuous improvement initiatives for yield/cycle time/cost, Collaborate cross-functionally with production and quality teams, Coach and mentor team members, Support new technology transfer and site expansion
Seniority
Senior, hands-on IC with leadership responsibilities
