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Section Manager, Wafer Probe & Test Engineering

Tainan, Taiwan💼 Full-time🗓 2026-08-05 → 2026-09-26

Core

Lead wafer probe engineering operations to drive manufacturing excellence, equipment performance, and team output in semiconductor manufacturing.

Role type

Senior IC Section Manager, Wafer Probe & Test Engineering

Builds

Wafer probing operations and test infrastructure for memory and storage products

Domain

Semiconductor manufacturing (Wafer Probe & Test)

Deliverable

production ML models | product features | dashboards & analysis | infrastructure

Required skills

Wafer probe engineering, ATE tester operation (Teradyne/Advantest), Prober equipment management, Yield analysis, Probe card behavior, Wafer test flow, SOP development, Team leadership, Data-driven decision making

Preferred skills

DRAM/memory testing experience, High-volume manufacturing (HVM) environment, US-based company experience, Ownership mindset, Proactive problem solving

Technologies

Teradyne, Advantest

Responsibilities

Lead and manage wafer probe engineering team to achieve quality, output, and cycle time targets; Drive probe card, tester, and prober equipment performance optimization (OEE, UPH, yield); Collaborate with cross-functional teams to resolve excursion and yield issues; Establish and improve standard operating procedures (SOP) and best practices; Develop engineering talent and leadership pipeline; Implement data-driven decision making and continuous improvement initiatives

Seniority

Senior, hands-on IC with management responsibilities

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