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Wafer Manufacturing Section Manager

Tainan, Taiwan💼 Full-time🗓 2026-04-21 → 2026-07-31

Core

Lead high-volume semiconductor frontend production operations, managing daily wafer fabrication to meet output and delivery targets while driving yield and productivity.

Role type

Senior IC manufacturing operations manager (semiconductor frontend)

Builds

High-volume memory and storage products (DRAM, NAND, NOR) for data centers, AI, 5G, and mobile applications

Domain

Semiconductor manufacturing (frontend wafer fab)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Wafer process flow knowledge (Litho, Etch, Thin Film, Diffusion, CMP), High-volume manufacturing operations, Shift/line management, WIP handling, Yield and cycle time ownership, Cross-functional alignment with Process/Equipment Engineering

Preferred skills

Lean/Six Sigma concepts, Multinational semiconductor company experience, DRAM/advanced node manufacturing experience, Fab KPI management (yield, cycle time, WIP control)

Technologies

Lithography, Etching, Thin Film deposition, Diffusion, Chemical Mechanical Polishing (CMP)

Responsibilities

Lead daily wafer fabrication operations to meet output, cycle time, and delivery targets; Manage and develop production teams in cleanroom environment; Monitor and drive manufacturing KPIs (WIP, cycle time, OEE, tool utilization); Support process control, excursion handling, and root cause analysis; Lead continuous improvement initiatives to optimize fab capacity and resource allocation

Seniority

Senior, hands-on IC

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