HBM Talent Pool – Engineering, Manufacturing & Facilities (HBM人才專區-台中后里)
Core
Building a long-term talent pool for advanced High Bandwidth Memory (HBM) manufacturing, assembly, test, automation, and facility systems in Taichung, Taiwan.
Role type
Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership roles within semiconductor fabrication.
Builds
Advanced memory and storage solutions (HBM) for data centers, AI, and 5G applications.
Domain
Semiconductor manufacturing (Fab operations), HBM production, and facility systems.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing experience, fab operations knowledge, facility systems expertise, process optimization, yield improvement, new product introduction (NPI), equipment maintenance, quality assurance, continuous improvement, safety compliance.
Preferred skills
Adaptability to dynamic manufacturing environments, interest in advanced technology deployment.
Technologies
HBM manufacturing equipment, fab automation systems, utility systems, advanced memory production tools.
Responsibilities
Support and improve HBM manufacturing, assembly, test, automation, or facility systems; Drive process optimization and yield improvement; Maintain and optimize manufacturing equipment; Support new product introduction (NPI), qualification, and production ramp; Collaborate with cross-functional teams; Participate in continuous improvement, safety, and operational excellence initiatives; Manage shift operations, staffing, safety, and daily execution for supervisory roles.
Seniority
Entry-level to Senior, including supervisory and leadership tracks.
