Probe Integration Engineer (Test Solutions Engineering)
Core
Develop, deploy, and support wafer probe equipment and processes for high-volume manufacturing, specifically focusing on High Bandwidth Memory (HBM) and integrating AI-assisted tools to improve efficiency and quality.
Role type
Senior IC manufacturing equipment integration engineer
Builds
First-of-a-kind wafer prober, tester, and probe card equipment capabilities and standardized global probe processes
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models | product features | infrastructure
Required skills
mechanical and electrical engineering fundamentals, thermal systems design, electro-mechanical controls, statistical analysis, design of experiments, project management, 3D CAD software, MS Office proficiency
Preferred skills
semiconductor process knowledge, semiconductor device test methodology, demonstrated leadership, AI literacy
Technologies
Wafer Probers, Testers, Probe Cards, 3D CAD, MS Office
Responsibilities
Integrate AI-assisted tools into daily work to improve efficiency and quality; Deploy first-of-a-kind equipment and process capabilities through evaluations of Wafer Probers, Testers & Probe Cards; Collaborate with global teams to establish and implement best-known probe processes; Engage equipment suppliers & vendors to address quality and performance issues; Establish manufacturing metrics to drive continuous improvement; Perform statistical analysis of manufacturing data to ensure quality standards; Generate equipment specifications to meet safety and capability requirements.
Seniority
Senior, hands-on IC
