Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Develop reliability test flows, execute qualification plans, and drive root cause analysis for High Bandwidth Memory (HBM) products to ensure quality, yield, and performance.
Role type
Senior IC reliability engineer (semiconductor manufacturing)
Builds
HBM memory chips and storage products
Domain
Semiconductor manufacturing / Memory technology
Required skills
root cause analysis, electric failure analysis (EFA), physical failure analysis (PFA), CMOS technology knowledge, DRAM architecture understanding, data analysis, statistics, Python scripting, JMP, project management, cross-functional collaboration
Preferred skills
coursework or internship in semiconductor devices, circuit design, or product validation
Technologies
Python, JMP
Responsibilities
Define and develop reliability stress test flows and plans; manage qualification execution and gating issue resolution; drive DPM reduction through optimized manufacturing test strategies; debug and resolve defectivity and intrinsic reliability issues; provide recommendations for new process conversions to fab teams; manage risks associated with process conversions; collaborate with Fab, Design, and Quality teams (via careerplan.io/jobs/JR97874-engineer-product-engineering-media-health-reliability-heteregenous-integration-high-bandwi)
Seniority
Senior, hands-on IC
