Photolithography Advanced DRAM Process Development
Core
Developing manufacturing-friendly photolithography processes for next-generation DRAM storage devices using 365, 248, and 193 immersion lithography.
Role type
Sr. Engineer in photo process development (IC)
Builds
Next generation DRAM memory devices
Domain
Semiconductor manufacturing / Photolithography
Deliverable
production ML models | product features
Required skills
Photolithography process development, Root-cause analysis, Data analysis, Machine learning, Equipment/material vendor engagement, IP identification and filing, Cross-section analysis, Critical dimension measurement, Registration analysis, Physics/Optics/EE/Materials Science background
Preferred skills
Data science and programming, Photolithography simulation software, Material properties characterization, Semiconductor manufacturing experience
Technologies
365nm, 248nm, 193nm immersion lithography, EBL, nanoimprint lithography, photonics, optics
Responsibilities
Lead a module within next generation storage device development, Develop new photolithography processes, Innovate design and layout techniques, Identify and file IP opportunities, Use data analysis and ML to identify root causes of device failure, Document and communicate project plans and results
Seniority
Senior, hands-on IC
