Engineer CE PYE (Physical Failure Analysis/Fault Isolation)
Core
Perform sophisticated electrical device characterization, operate fault isolation equipment, and conduct physical failure analysis to identify, classify, and root-cause defects in memory devices.
Role type
Physical Failure Analysis (FA) Engineer
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing and memory technology
Deliverable
physical/clinical work
Required skills
electrical device characterization, fault isolation equipment operation, physical defect classification, process flow understanding, test sequence analysis, root cause analysis, hypothesis generation for fail mechanisms, tool maintenance coordination
Preferred skills
NAND/DRAM/HBM device knowledge, Fab process knowledge, AI/machine learning exposure for fault isolation, shift rotation flexibility
Technologies
fault isolation equipment, electrical fail models
Responsibilities
Perform electrical device characterization to determine fail mechanisms; Operate fault isolation equipment to narrow down defect locations; Conduct physical failure analysis to identify and classify defects; Establish and hypothesize potential fail mechanisms based on electrical and physical characterization; Collaborate with frontend, backend, and Quality teams to resolve defectivity issues; Prepare and present comprehensive failure mechanisms reports; Develop and implement new fault isolation and analysis techniques; Coordinate maintenance of fault isolation tools
Seniority
Individual Contributor, domain expert level
