Engineer, Material
Core
Driving packaging material qualification, material improvements, and supplier quality management to support manufacturing cost, quality, delivery, and risk objectives.
Role type
Material Engineer (Packaging & Semiconductor Manufacturing)
Builds
Qualification reports, material improvements, supplier corrective actions
Domain
Semiconductor manufacturing / Packaging materials
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Material qualification, statistical analysis tools (SPC, JMP), root cause analysis (8D), laboratory equipment operation, supplier quality management, change management, 6S standards
Preferred skills
AI tool integration, continuous improvement methodologies, semiconductor industry knowledge
Technologies
JMP, GDMS, SQN, 8D, SPC
Responsibilities
Execute packaging material qualification testing (ESD, flatness, dimensional, drop, vibration, strength, banding, water leak), plan and perform qualification testing, apply statistical and quality tools to support root cause analysis, operate and support laboratory tools and equipment for material qualification and failure analysis, maintain supplier quality management activities including defect assessment and corrective action driving, conduct change management when material changes are initiated, maintain 6S standards and ensure effective material, sample, and asset management in the material laboratory
Seniority
Entry to Mid-level, hands-on IC
