Engineer, Yield Enhancement PDE (Package Development Engineering)
Core
Monitor, manage, and stabilize yield for High Bandwidth Memory (HBM) New Product Introduction (NPI) builds from first silicon through early High Volume Manufacturing.
Role type
Entry-level IC yield enhancement engineer (semiconductor manufacturing)
Builds
HBM memory chips for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing (memory/storage)
Deliverable
production ML models | product features | dashboards & analysis | client delivery | infrastructure | physical/clinical work
Required skills
yield analysis, defect breakdown, Physical Failure Analysis (PFA), Statistical Process Control (SPC), Fault Detection & Classification (FDC), data analysis tools, AI tool integration
Preferred skills
Auto-diagnostics software, semiconductor industry internship, leadership track record, Micron domain knowledge
Technologies
Auto-diagnostics, SPC, FDC, yield dashboards
Responsibilities
Account for HBM NPI builds across Post Wafer Finishing, Assembly, and test through defect breakdown and PFA submission; Analyze and report on yield deviation issues to trigger actions from Process Integration or Process Engineering; Assist in maintaining yield dashboards and trackers to identify and transform processing data; Brainstorm with cross-functional staff to propose continuous improvement opportunities; Utilize software tools like Auto-diagnostics to find yield improvement opportunities; Integrate AI-assisted tools into daily work to improve efficiency and quality.
Seniority
Junior, hands-on IC