Senior / Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Define and develop reliability stress test flows and plans for HBM products, driving down defect rates through optimized manufacturing test strategies and root cause analysis.
Role type
Senior IC reliability engineer (semiconductor manufacturing)
Builds
HBM memory products for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), CMOS technology knowledge, DRAM architecture understanding, Data analysis and statistics, Python scripting, JMP usage, Root cause analysis, Process conversion recommendations, Risk management, Cross-functional collaboration, Project management, Technical decision making
Preferred skills
Coursework or internship in semiconductor devices, circuit design, or product validation
Technologies
Python, JMP
Responsibilities
Define and develop reliability stress test flows and plans; Manage qualification execution progress and drive issue resolution; Drive down Extrinsic and Intrinsic Reliability (DPM) through optimized test strategies; Debug and identify root causes of device issues via EFA and PFA; Provide recommendations to fab teams for new process conversions to reduce cost and increase yields; Manage risks associated with DPM process conversions; Mentor team members; Make final decisions on risk analysis and project prioritization; Collaborate with Fab, HBM Technology, Design, and Quality teams
Seniority
Senior, hands-on IC
