Senior Manager - HIG-HBM Product Engineering (Media Health Reliability)
Core
Spearhead and develop a high-performing team driving intrinsic and extrinsic reliability test development and execution for Micron's latest HBM products (DRAM, Interface die, and stacked products) to ensure quality, cost, and cycle time KPIs.
Role type
Senior Manager, HBM Product Engineering (Reliability)
Builds
High Bandwidth Memory (HBM) products for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM architecture
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Reliability test flow development, Extrinsic DPM reduction, Intrinsic reliability characterization, Root cause analysis (EFA/PFA), Process conversion management, Risk management, Cross-functional collaboration, Team mentorship, Technical decision making
Preferred skills
Semiconductor device experience, Circuit design, Product validation, CMOS technology knowledge, DRAM architecture knowledge, Device physics understanding, Data analysis, Statistics, Python scripting, JMP usage
Technologies
Python, JMP, EFA, PFA
Responsibilities
Define and develop reliability stress, test flows, and test plans; Manage qualification execution progress and gating issue resolution; Drive down Extrinsic and Intrinsic Reliability (DPM) through optimized manufacturing test flows; Debug and identify root causes of qual and RMA failures via electric and physical failure analysis; Provide recommendations to fab teams for new process conversions to reduce cost and increase yields; Manage risks associated with DPM process conversions; Develop and mentor team members; Make final decisions on risk analysis and project prioritization; Collaborate with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.
Seniority
Senior Manager, hands-on leadership with strategic oversight
