SENIOR/STAFF ENGINEER, TEST SOLUTIONS ENGINEERING
Core
Developing, debugging, and delivering wafer/cube probe test solutions for High Bandwidth Memory (HBM) devices across the product lifecycle from NPI to HVM.
Role type
Senior/Staff IC Test Solutions Engineer (HBM Probe)
Builds
Wafer/cube probe test solutions, ATE test programs, and debug methodologies for HBM silicon
Domain
Semiconductor manufacturing, memory products (HBM, DRAM), probe card systems
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
semiconductor test engineering, wafer/cube probe expertise, ATE test program development, silicon debug, root cause analysis, yield optimization, NPI execution, cross-functional leadership, data analysis, hardware-software interaction resolution
Preferred skills
experience in memory products (HBM, DRAM), high-speed digital devices, mentorship, standardization of probe practices
Technologies
ATE systems, probe cards, load boards, probers, semiconductor test equipment
Responsibilities
Define and drive probe test plans including coverage strategy and defect screening; develop and debug ATE test programs with full accountability; lead root cause analysis for complex wafer/cube probe failures; own probe data analysis to identify yield gaps and defect mechanisms; drive probe bring-up for first silicon and ensure readiness for characterization; optimize probe test time and cost targets while balancing coverage vs. efficiency; mentor engineers and drive adoption of best-known methods in probe test development
Seniority
Senior/Staff, hands-on IC with technical leadership and mentorship responsibilities
