CareerPlanGet AI match score →

F15 Advanced Technology Japan PI Device Engineer

Hiroshima - Fab 15, Japan💼 Full-time🗓 2026-04-09 → 2026-07-30

Core

Ensuring process stability and driving yield/quality improvements for high-volume DRAM manufacturing by optimizing device performance and process conditions.

Role type

Process Integration Engineer (Device)

Builds

High-volume DRAM memory chips

Domain

Semiconductor manufacturing / Memory and storage

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor manufacturing knowledge, Data analysis, Statistics, Cross-functional collaboration

Preferred skills

Semiconductor process engineering, Yield improvement, Defect analysis, Metrology analysis, SPC, Structured problem solving

Technologies

SPC, Metrology tools

Responsibilities

Create SWRs for device performance improvement, Optimize process integration and device performance sweet spots, Proceed with PCRB using data summaries

Seniority

Individual Contributor

Sourced via workday · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.
Apply on Workday ↗