HIG HBM - PE Design Validation Engineering Intern
Core
Design Validation Product Engineer developing next-generation High Bandwidth Memory (HBM) products, integrating front-end and backend processes for ML/AI applications.
Role type
Design Validation Product Engineer (HBM)
Builds
Next-generation HBM products (stacked DRAM and logic chips via TSV) for Machine Learning and Artificial Intelligence.
Domain
Semiconductor / Memory / Machine Learning
Deliverable
production ML models
Required skills
Schematic design, Circuit simulation, Data analysis, Lab debugging, Pattern manipulation, JEDEC specifications knowledge, Internal architecture documentation
Preferred skills
VLSI coursework, Semiconductor process knowledge, Python, C/C++, Verilog, VHDL, System Verilog
Technologies
TSV, DRAM, Logic chips, DDR, LPDDR, Python, C/C++, Verilog, VHDL, System Verilog
Responsibilities
Validate HBM designs, create internal architecture documentation, perform hardware and software debugging, conduct circuit simulations, analyze data
Seniority
Intern