半導体エンジニア（2026・2027年卒／既卒歓迎）｜Semiconductor Engineer – Class of 2026/2027 & Recent Graduates
Core
Developing mass production processes, next-generation CMOS transistors/capacitors, and evaluating DRAM prototypes to enable high-performance, low-power memory solutions.
Role type
Semiconductor Manufacturing & Process Development Engineer
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing and device physics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process technology (dry etching, thin-film deposition), data analysis, root cause analysis, equipment operation and maintenance, quality assurance protocols
Preferred skills
CMOS transistor design, circuit evaluation, statistical process control
Technologies
Dry etching, thin-film deposition, specialized DRAM testers, cleanroom environments
Responsibilities
Optimize chemical reactions and operating conditions for mass production; analyze defects and out-of-spec issues to improve product processes; measure and analyze performance indicators (speed, power, voltage) of prototype wafers and chips; propose and implement device structure optimizations; manage raw materials and inspection systems
Seniority
Entry-level (Class of 2026/2027 graduates and recent graduates)
