Sr Engineer, Process Integration, NAND NTI
Core
Designing, developing, integrating, and implementing process solutions to improve next-generation 3D NAND product yield and quality.
Role type
Senior IC process integration engineer (semiconductor manufacturing)
Builds
Next-generation 3D NAND memory products
Domain
Semiconductor manufacturing / Non-volatile memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Data analysis, problem-solving, process integration optimization, cross-functional team leadership, CSPEC criteria development, technology transfer, yield improvement, manufacturing process capability, alpha/derivative part evaluation, proof of concept establishment, technology ramp-up and qualification
Preferred skills
PhD in Material Science/Electrical Engineering/Microelectronics/Chemical/Physics Engineering, 2+ years semiconductor industry experience, JMP/Tableau proficiency, holistic end-to-end PI module understanding, NAND process flow knowledge, structural & electrical fail mechanism analysis, R&D product life cycle experience
Technologies
NAND, 3D NAND, JMP, Tableau
Responsibilities
Identify and quantify key module deficiencies and technology gaps; Develop or redefine CSPEC criteria for optimal product performance; Coordinate activities at the manufacturing site to secure funding for experiments and conversions; Undertake development projects to evaluate and implement new integration schemes; Lead quarterly yield summits and monthly program reviews; Assist in the transfer of new technology from R&D to manufacturing
Seniority
Senior, hands-on IC