Process Engineer Senior
Core
Lead process development and equipment ownership for 300mm wafer-level packaging tools, specifically focusing on fanout packaging processes including photolithography, panelization, molding, dicing, and grinding.
Role type
Senior IC process engineering lead (semiconductor advanced packaging)
Builds
Robust wafer packaging processes and equipment solutions for device physics, deposition, etching, and electrical test teams
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Statistical process control, data analysis, equipment maintenance, process development, IP development, team supervision, procedure writing, cross-training, conflict resolution
Preferred skills
Molding, grinding, die attach, ball drop, wafer saw operation, active matrix TFT processing, amorphous-silicon processes, thin film processing, JMP or Minitab, semiconductor advanced packaging experience
Technologies
300mm wafer packaging toolsets, JMP, Minitab
Responsibilities
Maintain equipment operations and increase uptime, respond to production issues, develop new processes and identify improvements, supervise a team of 3-4 engineers and technicians, interact with students and faculty to provide technical services, write safety procedures
Seniority
Senior, hands-on IC with team leadership