Dry Etch MTS/Principal Engineer, Process Development, Advanced NAND
Core
Lead dry etch process development and innovation for Next Generation NAND modules, managing chambers and roadmaps to achieve yield targets.
Role type
Principal Engineer/MTS (Member of Technical Staff)
Builds
Next Generation NAND products
Domain
Semiconductor manufacturing (NAND Flash)
Required skills
Dry etch process development, Plasma physics/chemistry, Statistical process control, Cross-functional leadership, Scalability problem solving, Equipment roadmap planning, Supplier management, Data analysis (SAS/Python), AI tool integration
Preferred skills
Python coding, AI coders, Advanced conventional/unconventional pulsing schemes
Technologies
RF sources, SAS (JmP), Python, AI-assisted tools
Responsibilities
Develop and innovate dry etch processes, Lead cross-functional teams to solve structural problems, Present technology roadmaps, Mentor junior engineers, Predict and mitigate future process issues, Manage dry etch chambers
Seniority
Principal, hands-on IC with mentorship