Intern - HIG HBM DTPCO
Core
Intern analyzing semiconductor product and manufacturing data to understand device performance and chip-package interactions.
Role type
Intern, data analysis & silicon learning
Builds
Data-driven solutions for engineering workflows and device characterization
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Deliverable
production ML models
Required skills
Python, JMP/JSL, SQL, data visualization, statistics, root-cause analysis, cross-functional data correlation
Preferred skills
AI/Generative AI/Agentic AI application, semiconductor device knowledge, automation of engineering workflows
Technologies
Python, JMP, SQL, MATLAB, Generative AI, Agentic AI
Responsibilities
Analyze probe, parametric, characterization, electrical, process, and manufacturing data; Support engineering experiments and silicon learning; Perform cross-functional data correlation; Develop automated data-analysis workflows; Apply AI to improve engineering workflows.
Seniority
Intern
