Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Define and develop reliability stress test flows and plans for HBM products, drive DPM reduction, and resolve root causes of device failures using electric and physical failure analysis.
Role type
Senior IC reliability engineer (semiconductor)
Builds
HBM memory products for data centers and AI applications
Domain
Semiconductor manufacturing and reliability engineering
Deliverable
production ML models
Required skills
Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Python scripting, statistical data analysis, CMOS technology knowledge, DRAM architecture understanding, root cause analysis, project management, cross-functional collaboration
Preferred skills
Experience with AI/automation tools (Claude, agentic AI), machine learning (regression, classification, anomaly detection), semiconductor device physics, process conversion optimization
Technologies
Python, JMP, Claude, agentic AI platforms
Responsibilities
Develop reliability test flows and qualification plans; execute qualification tests and manage gating issues; debug and resolve defectivity and intrinsic reliability failures; provide recommendations for fab process conversions to improve yield and cost; manage risks associated with DPM process conversions; apply machine learning to reliability datasets to segment fails and outliers; mentor team members on AI-first workflows
Seniority
Senior, hands-on IC
