CareerPlan

Principal DRAM Process Pathfinding - Dry Etch

Boise, ID - Main Site, USFull-time2026-11-03 → 2026-11-10

Core

Lead dry etch process development and optimization for current and future semiconductor technology nodes.

Role type

Principal semiconductor process engineer (dry etch)

Builds

Dry etch processes and technology roadmaps for memory and storage solutions

Domain

Semiconductor manufacturing / Plasma etch

Required skills

Dry etch process development, ICP and CCP tool expertise, Plasma physics knowledge, Cross-functional team leadership, Defect and equipment problem solving

Preferred skills

Advanced CMOS and DRAM technology experience, Statistical process control, Equipment vendor management, AI-assisted analytics

Technologies

ICP, CCP, RF sources, Dry etch reactors

Responsibilities

Lead development and optimization of dry etch processes to meet structural and electrical specifications; Partner with process integration teams to influence integration flows and technology roadmaps; Lead cross-functional task forces to resolve complex process and defect challenges; Develop and present process and technology roadmaps; Serve as a technical resource and mentor for dry etch engineers

Seniority

Principal, hands-on IC with mentorship