ENGINEER, MTB PI
Core
Identify, diagnose, and resolve assembly process problems while leading yield improvement and cost reduction initiatives for memory and storage manufacturing.
Role type
Senior IC manufacturing process engineer (AI-enabled)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing (Memory/Storage)
Deliverable
production ML models
Required skills
Assembly process troubleshooting, Yield improvement, Cost reduction, SPC/FDC/RMS/APC support, Material supplier management, Site-to-site portability, AI-enabled data analytics, Process optimization
Preferred skills
AI development capability, AI-assisted yield trend analysis
Technologies
SPC, FDC, RMS, APC, AI tools
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization; Lead continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC; Manage and audit material suppliers; Support internal and external audits; Leverage AI-enabled tools to improve engineering efficiency and analyze yield trends.