Mechanical/Thermal Principal Design Engineer
Core
Lead mechanical and thermal architecture for next-generation memory and AI computing platforms, driving design from concept through mass production.
Role type
Principal Mechanical/Thermal Design Engineer
Builds
Advanced electronic systems, modules, and emerging memory technologies (DDR, LPDDR, PCIe, HBM, AI accelerators)
Domain
Semiconductor / Memory & Storage / AI Computing
Deliverable
production ML models | product features
Required skills
Thermal management, mechanical design, heat transfer, fluid dynamics, GD&T, tolerance analysis, DFM/DFA, reliability modeling, root cause analysis, technical leadership
Preferred skills
AI-enabled engineering workflows, JEDEC standards, data center/server hardware architectures, global supplier collaboration
Technologies
SolidWorks, ANSYS Icepak, ANSYS Fluent, CFD, FEA, thermal characterization tools, shock/vibration testing equipment
Responsibilities
Design, develop, test, validate, and release mechanical and thermal solutions; Develop innovative cooling solutions (heat spreaders, vapor chambers, heat pipes, liquid cooling); Define mechanical, thermal, reliability, and manufacturability requirements; Perform and lead thermal CFD and mechanical FEA analyses; Develop and implement validation strategies (thermal cycling, humidity testing, DFMEA); Drive design reviews, risk assessments, and corrective actions; Mentor engineers and establish engineering guidelines
Seniority
Principal, hands-on IC with strategic influence
