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STAFF ENGINEER, TDT PD DRY ETCH

Taichung - Fab 16, Taiwan💼 Full-time🗓 2026-09-11 → 2026-09-26

Core

Identify, diagnose, and resolve assembly process problems while leading yield improvement and cost reduction initiatives for memory and storage manufacturing.

Role type

Staff Engineer, Dry Etch Process Development

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing (memory and storage)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

process optimization, yield improvement, cost reduction, SPC/FDC/RMS/APC support, supplier management, audit management, AI-assisted problem solving

Preferred skills

site-to-site portability expertise, new product introduction validation

Technologies

SPC, FDC, RMS, APC, AI tools

Responsibilities

Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization; Lead continuous yield improvement and cost reduction activities; Validate and fan out new process baselines for new product introduction; Support SPC/FDC/RMS/APC; Manage and audit material suppliers; Support internal and external audits

Seniority

Staff, hands-on IC

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