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OMT RAM NPI RDA Application Engineer

Taichung - Fab 16, Taiwan💼 Full-time🗓 2026-09-01 → 2026-09-26

Core

Develop, qualify, and sustain inspection and application solutions to support DRAM new product introduction and high-volume manufacturing, focusing on yield improvement and defect detection.

Role type

Senior IC application engineer (semiconductor manufacturing/inspection)

Builds

Inline monitoring strategies, defect detection systems, and yield improvement initiatives for advanced DRAM technologies

Domain

Semiconductor manufacturing, specifically DRAM production and inspection

Deliverable

production ML models | product features | dashboards & analysis

Required skills

Engineering fundamentals, data-driven problem solving, root cause analysis, cross-functional collaboration, technical documentation, AI-enabled tool utilization

Preferred skills

DRAM manufacturing experience, electron beam inspection (EBI) expertise, Python/JMP programming, layout-based analysis (KLayout), structured problem-solving methodologies (FA, DOE, SPC, FMEA, 8D)

Technologies

Python, JMP, KLayout, EBI systems

Responsibilities

Develop and sustain inspection solutions for DRAM NPI and high-volume manufacturing; Enable robust inline monitoring for defect detection and yield learning; Analyze manufacturing and yield data to identify trends and limiters; Support root cause investigations for yield excursions; Drive continuous yield improvement and production stability; Support technology transfers and new product ramps; Evaluate new tools and methodologies for inspection effectiveness; Collaborate with global engineering and supplier partners to resolve technical issues; Contribute to standardization of inspection methodologies; Document results and lessons learned; Leverage AI-enabled tools for defect analysis and engineering decision-making

Seniority

Senior, hands-on IC

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