CareerPlan

TSE KEG Equipment Engineer

Boise, ID - Main SiteFull-time2026-09-01 → 2026-11-15
Based in United States

Core

Lead the development, qualification, and deployment of wafer probers, testers, probe cards, and supporting manufacturing technologies for semiconductor production.

Role type

Senior IC equipment engineer (semiconductor test solutions)

Builds

Wafer probing systems, test equipment, and probe card solutions for global semiconductor manufacturing

Domain

Semiconductor manufacturing / Test engineering

Required skills

Equipment engineering, systems integration, Design of Experiments (DOE), statistical analysis, CAD tools, root cause analysis, cross-functional project leadership

Preferred skills

Semiconductor manufacturing experience, supplier relationship management, 3D CAD and engineering analysis (thermal/stress/flow), JMP or similar data analysis software, AI-enabled tools and workflow automation

Technologies

CAD tools, JMP, AI-enabled tools, automation solutions

Responsibilities

Lead development and qualification of wafer probers and testers; Define equipment specifications and qualification strategies; Drive first-of-a-kind equipment introductions; Investigate deviations and implement corrective actions; Design and execute experiments to support continuous improvement; Develop manufacturing metrics and best-known methods.

Seniority

Senior, hands-on IC