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MGR, F16N CMP PEE

Miaoli - Tongluo, Taiwan💼 Full-time🗓 2026-08-27 → 2026-09-26

Core

Lead a Process Engineering team to achieve world-class manufacturing performance in safety, quality, yield, cycle time, cost, and output for semiconductor manufacturing.

Role type

Manufacturing Process Engineering Manager (IC)

Builds

Semiconductor memory and storage products (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing / Process Engineering

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor process engineering, manufacturing process flow, yield enhancement, process integration, team leadership, analytical troubleshooting, SPC, FDC, root cause investigation, change management, technology ramp

Preferred skills

AI-related experience, ability to guide teams in using AI

Technologies

SPC, FDC

Responsibilities

Own process performance indicators (yield, quality, cycle time, cost, output), drive continuous improvement and process optimization, ensure process stability and manufacturing readiness, lead root cause investigations and defect reduction, manage process change and risk control, lead new tool qualification and technology transfer, coach and develop Process Engineers

Seniority

Manager, hands-on IC with team leadership

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