ENGINEER - F15 MFG CMP Equipment Engineer
Core
Establish and improve CMP/BOND process conditions and technology for semiconductor manufacturing equipment.
Role type
Semiconductor equipment engineer (CMP/BOND)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process parameter setup, Abnormal analysis and improvement, Equipment upgrade planning, Vendor collaboration, Technical documentation, Cost management, Project schedule adherence, Hardware gap identification, Process capability evaluation, Production cost reduction
Preferred skills
Programming skills, Database understanding, Digital skills (Script, RPA, Tableau), Microsoft Office proficiency, Analytical problem solving, Multitasking, Time management
Technologies
CMP/BOND process tools, Semiconductor equipment, Script, RPA, Tableau, Microsoft Office
Responsibilities
Establish and improve process condition and technology, Upgrade process capability and reduce production cost, Set up process parameters for semiconductor equipment, Evaluate and plan new equipment and materials, Conduct abnormal analysis and improvement, Collaborate with equipment vendors, Create and maintain performance and maintenance documentation, Ensure safety compliance and conduct internal/external audits
