TSE TE OPS Engineer
Core
Support NPI and HVM manufacturing operations for memory and storage solutions, focusing on test program qualification, yield improvement, and equipment debugging.
Role type
Test Manufacturing Operations Engineer (NPI/HVM)
Builds
Test programs, qualification of new hardware (Burn In Board, Oven CSB, Tester, MOBO), and manufacturing process systems for DRAM/NAND/NOR memory.
Domain
Semiconductor manufacturing (memory and storage)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
backend manufacturing test handler equipment knowledge, problem analysis and decision making, 8D problem solving, data analysis tools (Decision Analysis, RA, FMEA), C/C++ programming, Unix/Linux environment
Preferred skills
AMHS system support, AI-based test result analysis, mechanical/electrical fundamentals of equipment
Technologies
SEC/GEMS, GPIB, IS communication protocols, AMHS, C/C++, Unix/Linux
Responsibilities
Drive investigation on yield toggle due to program bugs, support FOAK new hardware qualification, support legacy device return material authorization, update test time cut schedules, track test time and retest ratios, review new product proliferation test results using AI, support logistic lot handling, support site audits, resolve daily production test operation issues, commit to module yield and retest rates, debug AMHS test programs.
Seniority
Mid-level, hands-on IC
