TSE TE OPS Engineer
Core
Support NPI and HVM manufacturing operations for memory and storage solutions, focusing on test program qualification, yield improvement, and equipment debugging.
Role type
Senior IC Test Manufacturing Operations Engineer
Builds
Test programs, manufacturing processes, and qualified hardware for DRAM, NAND, and NOR memory products
Domain
Semiconductor manufacturing (Backend)
Required skills
Backend manufacturing test handler equipment knowledge, 8D problem solving, data analysis tools (FMEA, RA), C/C++ programming, Unix/Linux environment
Preferred skills
AI for test result analysis, AMHS system debugging, electrical/mechanical fundamentals
Technologies
SEC, GEMS, GPIB, IS, AMHS, C/C++, Unix/Linux
Responsibilities
Drive investigation on yield toggle due to program bugs, support FOAK new hardware qualification, manage legacy device support and rescreen programs, update test time cut schedules, analyze new product proliferation test results using AI, support logistic lot handling, conduct site audits, resolve daily production test issues, commit to module yield and retest rates, debug AMHS systems, identify and isolate deviations using systematic problem solving
Seniority
Mid-level, hands-on IC
