CareerPlan

PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS

Fab 10A, SingaporeFull-time2026-06-30 → 2026-11-13
Based in United States

Core

Principal Engineer leading wet process optimization, defect reduction, and tool efficiency improvements in semiconductor wafer fabrication.

Role type

Principal Engineer, Semiconductor Wet Process

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing (Wet Process: SWC, Bench, Scrub, Backside, Bevel)

Required skills

Semiconductor equipment and process management, Failure analysis (FMEA, 8D, SPC), Process yield improvement, Cost reduction, Root cause analysis, Hardware CIP roadmap development, IoT sensor integration, AI tool application

Preferred skills

Global site collaboration, Supplier management, Energy/waste reduction strategies, AI-enabled enhancement identification

Technologies

IoT sensors, AI-assisted tools, SPC, FMEA, 8D methodology