PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS
Core
Leading process optimization, yield improvement, and equipment qualification for wet process steps in semiconductor wafer fabrication.
Role type
Principal Engineer, Wet Process (Fab)
Builds
High-performance DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / Wafer fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor equipment and process management, Wet process expertise, Failure analysis and root cause analysis, Process yield improvement, Cost reduction strategies, Hardware CIP roadmap development, Supplier management, Safety and sustainability standards compliance, AI tool integration for operational tasks
Preferred skills
Advanced degree in Engineering or Materials Science, Experience with FOAK chemistry qualification, IoT sensor implementation for tool monitoring, Cross-functional collaboration for defect reduction
Technologies
IoT sensors, AI-assisted tools, SPC methodology, FMEA, 8D methodology
Responsibilities
Strategize and lead productivity, yield, quality, and cost improvement engagements globally; Develop roadmaps for process and hardware CIP implementation; Collaborate with suppliers to establish equipment start-up acceptance criteria; Improve tool efficiency and utilization through benchmarking; Set up IoT sensors for defense line strengthening; Enable new solutions for energy savings and waste reductions; Integrate AI-assisted tools to improve efficiency and effectiveness.
Seniority
Principal, hands-on IC with strategic leadership
