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Senior Engineer, Global Facilities - Tool Installation

Boise, ID - Main Site💼 Full-time🗓 2026-07-02 → 2026-10-07

Core

Lead global Tool Installation (TI) programs to standardize processes, optimize capacity planning, and drive continuous improvement across semiconductor fabrication facilities.

Role type

Senior IC facilities engineering program manager (semiconductor tool installation)

Builds

Standardized tool installation processes, capacity plans, and operational performance improvements for DRAM and NAND fabs

Domain

Semiconductor manufacturing (wafer fabrication)

Required skills

Program management, cross-functional collaboration, data-driven decision-making, process standardization, capacity planning, stakeholder influence, project scheduling, budget management

Preferred skills

300mm wafer fab experience, cleanroom utility systems knowledge, data visualization (Power BI/Tableau), CAD tools (AutoCAD/Revit), CAPEX/OPEX budgeting, Agentic AI workflow development

Responsibilities

Lead global TI programs and site-level projects; Drive standardization of TI best-known methods and business processes; Develop global alignment for TI systems and capacity planning; Monitor project schedules and KPIs to drive execution; Partner with facilities, procurement, and engineering to optimize tool installation; Mentor project managers and team members; Present strategic insights to senior leadership

Seniority

Senior, hands-on IC with program leadership