Senior Engineer, Global Facilities - Tool Installation
Core
Lead global Tool Installation (TI) programs to standardize processes, optimize capacity planning, and drive continuous improvement across semiconductor fabrication facilities.
Role type
Senior IC facilities engineering program manager (semiconductor tool installation)
Builds
Standardized tool installation processes, capacity plans, and operational performance improvements for DRAM and NAND fabs
Domain
Semiconductor manufacturing (wafer fabrication)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Program management, cross-functional collaboration, data-driven decision-making, process standardization, capacity planning, stakeholder influence, project scheduling, budget management
Preferred skills
300mm wafer fab experience, cleanroom utility systems knowledge, data visualization (Power BI/Tableau), CAD tools (AutoCAD/Revit), CAPEX/OPEX budgeting, Agentic AI workflow development
Technologies
Power BI, Tableau, AutoCAD, Revit
Responsibilities
Lead global TI programs and site-level projects; Drive standardization of TI best-known methods and business processes; Develop global alignment for TI systems and capacity planning; Monitor project schedules and KPIs to drive execution; Partner with facilities, procurement, and engineering to optimize tool installation; Mentor project managers and team members; Present strategic insights to senior leadership
Seniority
Senior, hands-on IC with program leadership
