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EUV Mask Technology R&D Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-06-16 → 2026-07-30

Core

Developing materials, films, and processes for next-generation EUV lithography to enable High-NA EUV manufacturing readiness.

Role type

R&D Engineer (EUV Mask Technology)

Builds

Next-generation EUV mask materials and processes for advanced DRAM scaling

Domain

Semiconductor manufacturing / EUV Lithography

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

EUV mask blank material development, film stack design, deposition, etch, clean, and patterning quality analysis, High-NA EUV readiness optimization, lithography requirements translation, DOE and fundamental analysis, cross-functional collaboration, FEOL process engineering transition

Preferred skills

Semiconductor mask/lithography/wafer fabrication experience, actinic mask inspection, defect printability analysis, mask repair, BEOL/FEOL process control, tool requirements definition, equipment supplier engagement, EUV/High-NA EUV mask/wafer technology development, lithography simulation, OPC, mask pattern design

Technologies

EUV systems, mask-to-wafer correlation, pattern transfer fidelity, lithography simulation, OPC, mask pattern design

Responsibilities

Develop EUV mask blank materials and processes including film stack design, deposition, etch, clean, and patterning quality; Advance High-NA EUV readiness through material selection, mask design, stitching, lithography performance optimization, and lifetime improvement; Translate lithography requirements into manufacturable mask solutions; Conduct data-driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability; Collaborate with cross-functional engineering teams to transition new technologies into FEOL process engineering

Seniority

Mid-level, hands-on IC

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