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Yield Enhancement Engineer - Physical Failure Analysis

Boise, ID - Main Site💼 Full-time🗓 2026-06-15 → 2026-07-30

Core

Identifying yield issues by conducting electrical diagnostics and physical examination of failures to resolve root causes and improve device performance.

Role type

Yield Enhancement Engineer (Physical Failure Analysis)

Builds

Next-generation memory technologies and storage solutions

Domain

Semiconductor manufacturing and device physics

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

electrical diagnostics, physical failure analysis, root cause analysis, data analysis, statistics, coding tools, semiconductor fabrication knowledge, device physics understanding

Preferred skills

memory device architecture knowledge, SEM operation, FIB operation, TEM operation, advanced analytical problem-solving

Technologies

SEM, FIB, TEM

Responsibilities

Analyze probe, parametric, and fab data to identify yield issues; Perform electrical and physical failure analysis to resolve root causes; Collaborate with process and integration teams to resolve yield detractors; Develop and apply techniques to isolate and characterize device failures; Present findings and support technology transfer to manufacturing sites

Seniority

Mid-level, hands-on IC

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