Principal Engineer - Dry Etch, Operations Central Teams - Advanced Development Team
Core
Lead semiconductor process development and optimization for NAND & DRAM integration during early maturity phase, transitioning new products from technology development to high-volume manufacturing.
Role type
Principal Engineer, Semiconductor Process Development & Operations
Builds
High-volume manufacturing sites for memory and storage solutions
Domain
Semiconductor manufacturing (NAND/DRAM), Dry Etch, Process Control
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process development/optimization, Hardware management, Supplier management, NAND & DRAM integration, Experimental design, Data analysis, Statistical Process Control (SPC), Solid-state device physics, Semiconductor metrology, Defect analysis
Preferred skills
Master's Degree or PhD in relevant field
Technologies
Dry Etch equipment, Process control systems, Statistical analysis tools
Responsibilities
Collaborate with Technology Development on future technology requirements and manufacturing roadmap alignment, Partner with Manufacturing on supplier engagement to meet strategic objectives, Improve performance and enable customer qualification for new products, Ensure process safety requirements are met with EHSS and Process Hazard Analysis engineers, Engage with suppliers and industry consultants for benchmarking data, Develop sophisticated models for unit process and module level control/road mapping, Support module, process and hardware optimization for peers
Seniority
Principal, hands-on IC with strategic oversight