CareerPlan

Principal Engineer Photolithography DRAM Process Development (Evergreen)

Boise, ID - Main SiteFull-time2026-06-16 → 2026-11-13
Based in United States

Core

Lead photolithography process development for next-generation DRAM, owning process modules and translating concepts to manufacturable solutions on pilot lines and high-volume fabs.

Role type

Principal Engineer, Photolithography Process Development

Builds

Next-generation DRAM nodes using 365nm, 248nm, 193i, and EUV lithography

Domain

Semiconductor Manufacturing / Memory Technology

Required skills

Photolithography process development, Imaging fundamentals, Track and overlay control, Reticle management, OPC (Optical Proximity Correction), Scanner systems, DOE (Design of Experiments), Root cause analysis, Vendor engagement, Cross-functional collaboration

Preferred skills

R&D environment experience, Pilot line to production transfer, Data analysis and scripting, Data science, GenAI tools, Technical presentation

Technologies

EUV, 193i, 248nm, 365nm, OPC, Scanner systems

Responsibilities

Develop and optimize photo processes to meet device physical and electrical requirements, Lead a lithography module creating manufacturing-friendly solutions, Partner with integration and unit process teams, Analyze failures and perform root cause analysis, Document plans and drive transfer to production fabs

Seniority

Principal, hands-on IC with strategic roadmap ownership