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Equipment Technician, Advanced Packaging

Boise, ID - Main Site💼 Full-time🗓 2026-05-28 → 2026-07-31

Core

Monitoring, sustaining, and improving electro-mechanical equipment in the Advanced Packaging Technology Development department to support next-generation semiconductor manufacturing.

Role type

Equipment Technician (Semiconductor Manufacturing)

Builds

Next-generation memory and storage products (AI revolution)

Domain

Semiconductor manufacturing / Advanced Packaging

Deliverable

infrastructure

Required skills

AC/DC circuits, electronic components, algebraic problem-solving, SPC principles, PC/MS Office, mechanical/electrical evaluation, blueprint reading, diagnostic tool usage

Preferred skills

BS in EET, semiconductor industry experience, semiconductor tool maintenance knowledge

Technologies

MS Office, diagnostic equipment, electro-mechanical tools

Responsibilities

Perform electrical or mechanical evaluation to resolve problems in non-functioning electro-mechanical equipment; Dismantle, adjust, repair and assemble equipment according to layout plans, blueprints, operating or repair manuals; Use test and diagnostic equipment to perform checkouts and rebuild/modify manufacturing equipment; Troubleshoot and repair non-functioning electro-mechanical equipment using diagnostic tools and technical documentation; Perform equipment modifications as directed by engineering and rebuild systems as needed to support operations.

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