Product Development Engineer 1
Core
Conduct physical defect analysis on DRAM chips by correlating electrical failures with physical defects using advanced microscopy and de-processing techniques.
Role type
Physical Failure Analysis (PFA) Engineer
Builds
DRAM memory products
Domain
Semiconductor manufacturing / Hardware reliability
Deliverable
physical/clinical work
Required skills
Focused Ion Beam (FIB) operation, Scanning Electron Microscope (SEM) operation, Scanning Transmission Electron Microscope (STEM) sample preparation, Transmission Electron Microscope (TEM) sample preparation, wet and dry etching, mechanical polishing, CAD layout analysis, statistical data analysis
Preferred skills
Voltage contrasting (PVC), fault isolation, report writing
Technologies
FIB, SEM, STEM, TEM, CAD
Responsibilities
Operate FIB, SEM, STEM, and TEM equipment; perform layer-by-layer de-processing using wet/dry etch and mechanical polish; prepare lamella samples; correlate electrical failure modes to physical defects; save images and write detailed analysis reports; consult with customers; create PFA procedural reference documents
Seniority
Individual Contributor
