Memory Design Engineer | HBM - TPG
Core
Design and analyze digital and analog circuits for next-generation memory products, optimizing manufacturing functions and ensuring quality and reliability.
Role type
Senior IC memory design engineer (analog/digital)
Builds
High-performance memory chips (DRAM/mixed-signal) for global markets
Domain
Semiconductor / Memory / Analog & Digital Circuit Design
Deliverable
production ML models | product features
Required skills
CMOS circuit design, semiconductor device physics, schematic entry, Verilog, FastSPICE, HSPICE, timing/power/area trade-offs, layout (floor-planning, placement, routing), parasitic modeling, tape-out readiness
Preferred skills
RTL design flow experience, DFT concepts, scripting (Python, TCL, Perl), cross-functional collaboration
Technologies
FastSPICE, HSPICE, Verilog, Python, TCL, Perl
Responsibilities
Support circuit design, layout, and optimization for memory and logic/analog circuits; Perform parasitic modeling and design validation; Oversee layout process including floor-planning, placement, and routing; Perform verification using modeling and simulation; Collaborate with cross-functional teams to drive standardization; Partner with Marketing, Probe, Assembly, Test, and Process Integration to support manufacturability
Seniority
Mid-Senior, hands-on IC