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Senior Engineer, Technology - AMAIS

Boise, ID - Main Site💼 Full-time🗓 2026-05-29 → 2026-10-07

Core

Develop composite, physics-based, and ML-augmented models for DRAM module co-optimization, stress analysis, and yield improvement.

Role type

Senior IC engineer (multiscale modeling & ML)

Builds

Predictive composite models for DRAM modules, serving Process, PI, and PE engineering teams.

Domain

Semiconductor manufacturing, DRAM technology, computational physics

Deliverable

production ML models

Required skills

multiscale structural modeling, numerical methods, high-performance computing (HPC), machine learning, deep learning, C++, Python, Linux, physics-based modeling, data analysis

Preferred skills

multiphysics modeling, layout-aware stress analysis, semiconductor industry knowledge, process integration engineering

Technologies

C++, Python, Linux, HPC environments, ML/DL libraries

Responsibilities

Develop composite models for wafer- and die-level metrics, integrate ML into structural models, train models on sparse datasets, perform multiscale stress modeling, support root-cause analysis, drive model-informed process integration strategies