Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer
Core
Coordinate improvements in yield, quality, and output for DRAM/NAND process and production lines by designing experiments and analyzing complex data.
Role type
Process Integration Module Engineer
Builds
DRAM and NAND memory chips
Domain
Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Analytical thinking, logical reasoning, critical thinking, experimental design, data interpretation, root cause analysis, cross-functional collaboration
Preferred skills
Semiconductor industry experience, knowledge of Micron products, leadership experience
Technologies
Wafer fabrication tools, process recipes, shift engineering systems
Responsibilities
Collaborate with multi-functional teams to improve product yields and reliability, design and execute experiments to optimize fab processes, collect and interpret complex data to increase yields, troubleshoot wafer fabrication problems, perform root cause analysis on defects, communicate module issues to engineering and leadership teams, promote network synergy through benchmarking and standardization of best-known methods
Seniority
Mid-level, hands-on IC
