TEG Engineer
Core
Optimize high-volume manufacturing equipment and processes for integrated circuit production, ensuring control over critical dimensions and defectivity.
Role type
Module Engineer (Manufacturing)
Builds
High-volume manufacturing capacity and advanced packaging/testing solutions
Domain
Semiconductor manufacturing (back-end)
Required skills
Statistical process control (SPC), data-driven problem-solving, mechanical design, electrical circuitry, equipment management, maintenance, cleanroom operations
Preferred skills
Semiconductor manufacturing equipment knowledge, machine/equipment systemic troubleshooting, data analysis, Design of Experiments (DOE), Failure Modes and Effects Analysis (FMEA), Power BI, SQL Pathfinder, scripting tools
Technologies
JMP, SQL Pathfinder, Power BI
Responsibilities
Conduct tests and measurements to control critical dimensions and reduce defectivity; Recommend and implement modifications for operational improvements; Execute maintenance, repair, and continuous improvement initiatives; Manage equipment installation, conversion, and qualification; Facilitate technology transfers through training and audits; Collaborate with cross-functional teams and external suppliers.
Seniority
Entry to Mid-level (1-3 years experience or Master's degree)